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2026-01-16 16:52:19 BGA Packaging: Why It’s Ideal for Industrial-grade Storage Cards in Extreme Scenarios
Packaging technology directly impacts industrial-grade storage cards’ heat dissipation, vibration resistance, and protection level, critical for surviving harsh environments. Common packaging types include WSON, TSOP, and BGA, with BGA (Ball Grid Array) being the top choice for extreme industrial scenarios.
BGA uses an array of solder balls on the bottom for circuit connection. Compared to traditional TSOP packaging, BGA has a larger contact area with the PCB, improving conductivity and heat dissipation. This effectively reduces chip temperature rise in high-temperature environments, avoiding performance degradation due to overheating.
In terms of vibration and impact resistance, BGA’s solder ball connections are stronger. With specialized welding processes, BGA-packaged cards can withstand over 50G acceleration impact and 10-2000Hz high-frequency vibration, eliminating contact issues common in slot-type packaging. They are ideal for construction machinery, rail transit, and aerospace equipment.
WSON packaging is small (5mm×6mm) for compact embedded devices but has thin packaging, poor heat dissipation, and weak vibration resistance, suitable only for general industrial control. TSOP, a traditional thin small-outline package, has exposed pins, poor anti-interference, and low protection, suitable for old device upgrades or non-extreme scenarios.
BGA also supports onboard soldering, eliminating wear and contact risks from plug-in interfaces, enhancing long-term stability. Choose BGA for extreme environments (high vibration, high temperature, strong interference), WSON for space-constrained general scenarios, and TSOP for cost-sensitive old device upgrades.
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